As electronic systems grow smaller and face harsher conditions, the demand for durable, chemically resistant gaskets continues to rise. Fluorosilicone-based Form-In-Place (FIP) gaskets meet this challenge with exceptional chemical and thermal performance, making them ideal for mission-critical applications.

Aerospace technology demands exceptional performance, reliability, and safety. As the industry faces increasing challenges, materials must evolve to meet these needs.

E/E architectures are shifting to domain-centralized and zonal models, improving connectivity and integration. TennMax’s thermal and EMI solutions optimize key components for next-gen vehicles.