Technical FAQ

Here are a few commonly asked engineering and application questions about vacuum metallization (PVD):

  • Vacuum metallization—also known as physical vapor deposition (PVD)—is a vacuum process where a metal vapor condenses onto a substrate surface, forming a thin, bonded coating for EMI shielding, decorative or functional finishes.

  • In PVD, a solid metal source is vaporized in a vacuum (via evaporation, sputtering or arc), travels through the chamber, then condenses onto the part surface atom by atom to form a thin film.

  • PVD coatings can be applied to plastics, metals, ceramics and glass—using materials such as aluminum, titanium, alloys, nitrides or carbides—to provide wear resistance, EMI shielding, corrosion protection, or decorative finishes.

  • PVD coatings are typically harder, more corrosion‑resistant, and thinner than electroplating, operate at lower temperatures, offer precise thickness control, environmental benefits, and maintain dimensional tolerances.

  • Typical vacuum metallization (PVD) coatings range from about 0.05 µm to a few microns thick, depending on the application—thin decorative films may be <0.1 µm, while EMI or protective finishes often use 1–2 µm layers.