Lasagna Multileaf
       Cooling System

Lasagna Cooler is a slim profile & high performance cooling system. The system is designed to cool Intel Pentium, AMD, Cyrix, and other CPUs in advanced personal computers, SBC and servers. It also cools and enhances 3Dfx graphics chipsets. This patented Lasagna cooler is constructed with a thermally efficient Multileaf thin aluminum plates, and an embedded DC fan inside the "heat sink". The unique design achieves the highest efficiency in removing heat off amicroprocessor.

Socket 7 & 370 clip design lowers Lasagna resistance to below 1.2 °C/W.  This is most suitable for tight space designs using AMD-K6, Coppermine P III FC-PGA, and Celeron PPGA processors

Special features are:

• Superior Cooling Efficiency with Unique Compact Design
• Extra large active surface area for heat dissipation; many times larger than conventional sink design
• Low Profile, only 10 mm total height
• Built with a durable ball bearing micro Fan embedded in the "Sink"
• Designed to best work with state-of-the-art Thermal Interface Materials (PCM)
• With metal clip firmly fits Socket 7
• International Patents granted

    Specifications of Lasagna Slim CPU Cooler is posted here.

New compact design - only 40 x 40 x 11 mm, Lasagna BGA Coolers fit perfectly on all advanced 3D/2D accelerator graphics boards.  Lasagna BGA Coolers use special thermal adhesive tape (type 0), or use retention push pins  to securely (type A or B) install on your chipsets.  Check the Selection Guide.